【摘要】 针对某高热密度密闭机箱,按流程开展热设计工作。以机箱内各模块热耗为输入条件,结构要求为边界条件,依次进行冷却方式的选择、模块的热安装、风道设计、热仿真分析、优化设计和试验验证。通过有力的数据支撑,充分论证了此次热设计方案的可行性,同时提高了该设备的可靠性,可为其他类似电子产品的热设计提供参考。更多还原

【Abstract】 The thermal design is made in a procedure for a sealed cabinet with a high heat density. Choosing the cooling method,fixing modules by heat,designing the air duct,thermal simulation,structural optimization and experimental verification are conducted in sequence,based on the heat of every module within the cabinet and dependent on structural requirements. The feasibility of the thermal project is sufficiently demonstrated by supportive and concrete data,and the reliability is improved in a same way. Other similar thermal design for e-products can refer to it.更多还原