【摘要】 像素级数字化红外探测器具有更高的性能水平和更强的抗干扰能力,是红外探测器技术发展的重要方向之一。通过突破像素级数字化读出电路设计、低峰谷碲镉汞材料外延、器件制备工艺以及倒装互连等关键技术,研制出了一种512×8像素级数字化长波红外探测器组件,并对其性能进行了测试。此探测器的响应波段为■,平均峰值响应率为1.4×10¹¹ LSB/W,响应率非均匀性为9.13%,有效像元率为97.5%,噪声等效温差（Noise Equivalent Temperature Difference, NETD）为4.4 mK,动态范围为90.6 dB。测试结果表明,该探测器能够满足系统要求。更多还原

【Abstract】 The pixel-level digital infrared detector has higher performance and anti-interference ability, which is one of the important directions of infrared detector technology development. By breaking through key technologies such as pixel-level digital readout circuit design, low peak-valley HgCdTe material epitaxy, device fabrication process, and flip-chip connection, a 512×8 pixel-level digital long-wave infrared detector assembly is developed, and its performance is tested. The results show that this detector assembly can meet the system requirements, with spectral response range of ■, average peak responsivity of 1.4×10¹¹ LSB/W, responsivity non-uniformity of 9.13%, operable pixel factor of 97.5%, noise equivalent temperature difference（NETD） of 4.4 mK and dynamic range of 90.6 dB.更多还原