【摘要】 采用扫描电镜和光学显微镜观察研究了230～260℃焊接温度范围内Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构及生长动力学.结果表明,在该焊点界面形成的化合物可分为两层:靠铜侧的是厚且平直的γ-Cu5Zn8化合物层;靠焊料侧的则为另一薄且呈扇贝、粒状的CuZn化合物层.提高钎焊温度及延长反应时间基本不改变Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构和成分,但会使形成的界面金属间化合物层厚度增加.γ-Cu5Zn8金属间化合物层的厚度与反应时间的平方根呈线性关系,表明其生长由扩散机制控制.根据阿伦尼乌斯公式,Sn-9Zn-0.1S/Cu焊点界面γ-Cu5Zn8金属间化合物层反应活化能为22.09 kJ/mol.更多还原

【Abstract】 The microstructure and growth kinetics of intermetallic compounds formed during the soldering reactions between Sn-9Zn-0.1S solders and Cu substrates at various temperatures ranging from 230 to 260 ℃ were investigated using scanning electron microscope and optical microscope.The results indicate that a thick planar layer of γ-Cu₅Zn₈ next to Cu substrate and a thin particulate layer of CuZn adjacent to solder can be formed at the Sn-9Zn-0.1S/Cu interface, and the constituent of the interfacial intermetallics do not change with the increase of soldering temperature and the prolonged reaction time, while the thickness of γ-Cu₅Zn₈ layer increases with the soldering temperature and reaction time. The relationship between the thickness of γ-Cu₅Zn₈ layer and the square root of reaction time fits linear, which shows that the growth of the intermetallic layer is diffusion-controlled.Kinetics analysis indicated that the activation energy of the intermetallic growth was 22.09 kJ/mol.更多还原