节点文献
无氰镀金进展概述
Overview of Cyanide-free Gold Plating Progresses
【摘要】 氰化物镀金是目前广泛工业应用的工艺。本文介绍了一价金和三价金无氰镀金工艺研究进展,综述了无氰镀金体系的组成、操作条件、金沉积机制及优缺点,展望了无氰镀金工艺的发展方向。
【Abstract】 Cyanide gold plating process is widely used in industrial applications at present. In this paper,research progresses of cyanide-free monovalent and trivalent gold plating are introduced. Composition,operating condition,gold deposition mechanism,advantage and disadvantage of cyanide-free gold plating system are summarized. The development of cyanide-free gold plating is discussed.
【基金】 国家自然科学基金(21972118);创新群体项目(21621091)
- 【文献出处】 电镀与精饰 ,Plating & Finishing , 编辑部邮箱 ,2019年12期
- 【分类号】TQ153.18
- 【被引频次】6
- 【下载频次】410