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FEP含量对PTFE基高频PCB覆铜板性能的影响
The Effect to Characteristics of Copper Clad Laminates Based on Polytetrafluoroethylene with Different Content of Fluorinated Ethylene Propylene
【摘要】 主要介绍制备微波高频PCB覆铜板时,PTFE树脂中FEP乳液体积浓度对浸渍玻纤布树脂含量的影响,以及对制作的pp(Pre-pregnant)介电常数(Dk)和介电损耗(Df)的影响。试验显示,随着树脂中FEP乳液含量的增加,浸渍玻纤布树脂百分比降低,而Dk和Df值升高,用pp所制作PCB覆铜板的铜箔剥离强度随着FEP乳液含量的升高而增大。
【Abstract】 This article revealed that the effect on glue content, Dkand Dfdepending volume concentration of FEP emulsion in PTFE resin on of impregnated fiberglass cloth, when making microwave high frequency copper clad laminate. With the increase of the concentration of FEP emulsion in the resin, resin content in impregnated fiberglass cloth reduced while Dkand Dfincreased. In addition, peeling strength of copper foil of copper clad laminate made of impregnated fiberglass cloth increased with FEP content increase.
【关键词】 FEP;
浓度;
介电常数;
介电损耗;
剥离强度;
【Key words】 FEP; concentration; dielectric constant; loss tangent; peel strength;
【Key words】 FEP; concentration; dielectric constant; loss tangent; peel strength;
- 【文献出处】 电子与封装 ,Electronics & Packaging , 编辑部邮箱 ,2019年03期
- 【分类号】TN41
- 【被引频次】5
- 【下载频次】263