【摘要】 合成了一种半胱氨酸亚金的无氰、腈金化合物盐。以该亚金配合物为研究平台,开展了ENIG(化镍金)工艺研究。得到的最佳化学镀金工艺参数为:温度45～65℃,pH值1.5～2.5,亚金2.0～2.5 g/L,配体[Lig] 10～25 g/L。在此条件下,可以获得晶粒细小均匀、结合力好的化学镀金层。更多还原

【Abstract】 A cyanide-free aurous-cysteine compound salt was synthesized, and this aurous complex was used as a research platform to carry out the research on ENIG process. The optimal process parameters of electroless gold plating were determined as follows: temperature 45～65 ℃, pH value 1.5～2.5, aurous 2.0～2.5 g/L, ligand [Lig] 10～25 g/L. Under these conditions, the obtained electroless gold coating was fine and uniform, and with good adhesion.更多还原