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面成型光固化树脂温度与液位控制系统设计

Design of resin temperature and liquid level control system for MIP-SL

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【作者】 宗学文王丹张斌权坤熊聪

【Author】 ZONG Xue-wen;WANG Dan;ZHANG Bin;QUAN Kun;XIONG Cong;School of Mechanical Engineering,Xi’an University of Science and Technology;

【通讯作者】 王丹;

【机构】 西安科技大学机械工程学院

【摘要】 阐述了针对面曝光快速成型技术的基于Atmega 2560单片机的树脂温度控制和液位控制系统的组成。阐述了温控系统和液位系统的硬件组成,分别介绍了测温测距传感器以及四位数码管、液晶显示屏(LCD)的工作原理及相关接口电路设计。阐述了系统主程序设计流程,以及温控子系统程序和液位测量子系统程序流程。通过串口图形显示工具,观察对比不同调节参数下的温度曲线,对温控系统的比例—积分—微分(PID)控制算法进行了参数整定,确定了合适的PID系数,并在单片机系统中实现了控制算法,温度偏差±0. 35℃。同时,通过串口显示工具实时显示了液位变化时的蠕动泵转动状态,实现了液位控制算法,将制件过程中的液位波动始终保持在0. 15 mm以下。表明了前述控制系统设计的合理性和有效性。

【Abstract】 Composition of resin temperature control and liquid level control system based on Atmega2560 microcontroller unit( MCU) for mask image projection stereo lithography( MIP-SL) is introduced,and hardware of temperature control system and liquid level system are described in detail. The working principle and interface circuit design of the temperature and distance measuring sensor,four-bit digital tube and the liquid crystal display( LCD) are introduced respectively. Design flows of the main program of the system and the temperature control subsystem and liquid level measurement subsystem are described in detail. Through serial port graphics display tool,temperature curves under different adjusting parameters are observed and compared,and parameters setting of proportional integral differential( PID) control algorithm of temperature control system are carried out,appropriate PID coefficient is determined,and the control algorithm is realized in MCU system,the temperature deviation is± 0. 35 ℃. At the same time. The rotational state of the peristaltic pump is displayed in real time by the serial port display tool,and the liquid level control algorithm is realized. The fluctuation of liquid level in the process of fabrication is kept below 0. 15 mm,which indicates the rationality and validity of the design of the control system.

【基金】 国家自然科学基金资助项目(51875452)
  • 【文献出处】 传感器与微系统 ,Transducer and Microsystem Technologies , 编辑部邮箱 ,2019年04期
  • 【分类号】TQ324.8
  • 【被引频次】3
  • 【下载频次】266
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