节点文献

电弧离子镀低温沉积TiN薄膜的显微结构与残余应力(英文)

Microstructure and residual stress of TiN films deposited at low temperature by arc ion plating

  • 推荐 CAJ下载
  • PDF下载
  • 不支持迅雷等下载工具,请取消加速工具后下载。

【作者】 梅海娟赵升升陈伟王启民梁海峰

【Author】 Hai-juan MEI;Sheng-sheng ZHAO;Wei CHEN;Qi-min WANG;Hai-feng LIANG;School of Mechanical and Electrical Engineering,Shenzhen Polytechnic;School of Mechanical and Electrical Engineering, Guangdong University of Technology;Institute of Technology, East China Jiaotong University;

【机构】 深圳职业技术学院机电工程学院广东工业大学机电工程学院华东交通大学理工学院

【摘要】 采用电弧离子镀技术在316L不锈钢基体上低温沉积TiN薄膜,并利用EDS、SEM、XRD和纳米压痕仪研究基体偏压和温度对薄膜的显微结构、残余应力和力学性能的影响规律。结果表明,TiN薄膜表现出高度(111)择优取向的面心立方结构。随着基体偏压和温度的增加,衍射峰强度急剧增加,同时峰变窄,晶粒尺寸从6.2 nm增大到13.8 nm。当基体温度从10℃增加到300℃时,薄膜的残余压应力从10.2 GPa急剧下降到7.7 GPa,从而导致薄膜的硬度从33.1 GPa下降到30.6 GPa,而薄膜的结合力则从9.6 N增加到21 N。

【Abstract】 The TiN films were deposited on 316 L stainless steel substrates at low temperature by arc ion plating. The influences of substrate bias voltage and temperature on microstructure, residual stress and mechanical properties of the films were investigated by EDS, SEM, XRD and nanoindenter tester, respectively. The results showed that the TiN films were highly oriented in(111) orientation with a face-centered cubic structure. With the increase of substrate bias voltage and temperature, the diffraction peak intensity increased sharply with simultaneous peak narrowing, and the small grain sizes increased from 6.2 to 13.8 nm. As the substrate temperature increased from 10 to 300℃, the residual compressive stress decreased sharply from 10.2 to 7.7 GPa, which caused the hardness to decrease from 33.1 to 30.6 GPa, while the adhesion strength increased sharply from 9.6 to 21 N.

【基金】 Projects(51401128,51275095) supported by the National Natural Science Foundation of China;Project(SKLRS-2013-MS-03) supported by the Open Fund from the State Key Laboratory of Robotics and System,China
  • 【文献出处】 Transactions of Nonferrous Metals Society of China ,中国有色金属学报(英文版) , 编辑部邮箱 ,2018年07期
  • 【分类号】TG174.4
  • 【被引频次】7
  • 【下载频次】141
节点文献中: 

本文链接的文献网络图示:

本文的引文网络