【摘要】 综述了近年来LED封装用有机硅材料(包括苯基有机硅、环己烷基有机硅、含氟有机硅、含环氧基有机硅)以及有机硅复合材料(有机硅/无机纳米粒子复合材料、有机硅/环氧树脂复合材料)的研究进展,并对有机硅LED封装材料未来的研究方向进行了展望。更多还原

【Abstract】 This article described the research progress in silicone materials( including phenyl silicone,cyclohexyl silicone,fluorine-containing silicone and epoxy-containing silicone) and silicone composite materials( including silicone/inorganic nano-particle composite materials,silicone/epoxy resin) for LED packaging in recent years. In particular,the future research prospect of silicone LED packaging materials was proposed.更多还原