节点文献
后摩尔时代大规模集成电路器件与集成技术
Device and integration technologies for VLSI in post-Moore era
【摘要】 本文梳理了微纳电子器件技术从等比例缩小的技术路线发展到以功耗降低为核心的后摩尔时代技术路线的过程,阐述了从等比例缩小到功耗缩小的微纳电子器件技术发展趋势,并对后摩尔时代大规模集成电路的新器件与工艺技术,包括Fin FET、围栅晶体管、新型隧穿器件、单片三维集成工艺等进行了较为系统的分析,试图为大规模集成电路技术的持续发展提供新的视野和观点.
【Abstract】 We herein review the technology transition from the scaling-driven technical roadmap to the powerdriven post-Moore roadmap,focusing on the primary trend in micro/nanoelectronics devices.The novel devices and process integration technologies in post-Moore era,such as the Fin FET,gate-all-around transistor,tunneling FET,and the sequential 3 D integration process were systematically analyzed to provide new insights into the everlasting evolution of VLSI technology.
【关键词】 集成电路;
等比例缩小;
低功耗;
微电子器件;
FinFET;
围栅晶体管;
隧穿晶体管;
单片三维集成;
摩尔定律;
【Key words】 integrated circuit; scaling; low power; microelectronics devices; FinFET; gate-all-around transistor; tunneling field-effect transistor; sequential three dimensional integration; Moore’s law;
【Key words】 integrated circuit; scaling; low power; microelectronics devices; FinFET; gate-all-around transistor; tunneling field-effect transistor; sequential three dimensional integration; Moore’s law;
【基金】 国家重点研发计划(批准号:2016YFA0200504);国家自然科学基金(批准号:61474004,61421005)资助项目
- 【文献出处】 中国科学:信息科学 ,Scientia Sinica(Informationis) , 编辑部邮箱 ,2018年08期
- 【分类号】TN386
- 【被引频次】30
- 【下载频次】2065