【摘要】 介绍了美国、法国等西方红外强国在像素级数字化制冷长波红外焦平面探测器方面的研究现状及发展趋势。基于像素级ADC(模数转换)数字读出电路(ROIC)的不同实现架构,阐述了美国MIT实验室、法国Sofradir及CEA-Leti公司开发的像素级ADC数字读出电路原理及像素级数字化长波制冷红外焦平面探测器的最新研究成果。最后介绍了昆明物理研究所在像素级数字化制冷长波红外焦平面探测器研究方面取得的最新进展。昆明物理研究所突破像素级ADC设计等关键技术后,研制出320×256(30?m中心距)像素级数字读出电路,并与相同规格的长波制冷红外焦平面探测器互连,主要性能参数与国外同类像素级数字化长波焦平面探测器相当。更多还原

【Abstract】 The status and trend of pixel-level analog to digital conversion(ADC) in digital long wave infrared focal plane array detectors in USA and France are presented.With reference to the different architectures of the pixel-level ADC obtained by a read out integrated circuit(ROIC),the theoretical characteristics of the pixel-level ADC ROICs were discussed.Various types of pixel-level ADCs in digital long wave infrared focal plane array detectors were recently presented at the Massachusetts Institute of Technology(MIT) laboratory in the USA and at Sofradir & CEA-Leti in France.These are introduced alongside the results of the pixel-level ADC digital long wave cooled infrared focal plane array detector research conducted by the Kunming Institute of Physics in China.The key technology of pixel-level ADC ROICs was successfully identified,and a 320×256(30 ?m pitch) pixel-level ADC digital ROIC was developed and coupled to a long wave infrared cooled focal plane array detector by flip chip technology.The measured performance of the pixel-level ADC digital detector researched by the Kunming Institute of Physics is comparable with digital detectors abroad.更多还原