【摘要】 为了进一步提高氮化铝(AlN)填充有机硅树脂的导热能力,采用丁二酸(Sa)和硅烷偶联剂KH-570共同对AlN表面进行处理,并填充到甲基含氢硅油交联的甲基乙烯基硅油树脂(SR)中,制得氮化铝-丁二酸/有机硅复合材料(SR/Sa-AlN)。研究结果表明,Sa的加入有助于AlN的表面改性,提高复合材料的导热能力;粒径为2.0μm改性的SR/Sa-AlN有机硅复合材料的效果最好,采用粒径为2.0μm的改性SR/Sa-AlN与碳化硅(SiC)(粒径40nm)复配,配合比为60∶40条件下,制得的有机硅树脂基导热复合材料(SR/Sa-AlN/SiC)的导热系数为1.285W/(m·℃),达到了工业对导热胶的应用要求。更多还原

【Abstract】 To further improve the thermal conductivity of organic silicon resin filled by aluminum nitride(AlN),the surface of aluminum nitridetreated by succinic acid and silane coupling agent KH-570(noted as Sa-AlN),and then filled it to the methyl hydrogen silicone oil crosslinked methyl vinyl silicone resin(noted as SR)to prepared the thermal conductive composite material(SR/Sa-AlN).The results showed that the addition of succinic acid was useful for the surface modification of AlN and can improve the thermal conductivity of composite.AlN with the particle size of 2.0μm(SR/Sa-AlN)showed much higher thermal conductivity than others,and the thermal conductivity increased with the increase of AlN dosage.In addition,the thermal conductivity of SR/Sa-AlN/SiC(when the weight ratio of SR/Sa-AlN/SiC was 60∶40)was measured to be 1.285 W/(m·℃),which satisfied the industry application of thermal conductive adhesive.更多还原