【摘要】 采用有限元仿真软件建立了WCu热沉-陶瓷功率集成电路外壳的三维计算模型,并对不同Cu含量WCu热沉的封装残余应力进行了计算,从理论上分析了WCu热沉Cu含量对封装结构变形和残余应力分布的影响。结果表明,在Cu含量10~20%范围内,随着Cu含量的增加,陶瓷件的峰值应力由大变小,后又升高,应力集中位置也发生转移;热沉变形方向由正向弯曲逐渐变为负向弯曲,该规律得以试验验证。研究结果对该结构封装外壳可靠性评估和优化设计具有指导意义。更多还原

【Abstract】 In this paper,a three-dimensional calculation model of the shell of the ceramic WCu heat sink power integrated circuit is established by using the finite element simulation software,calculated the residual stress of WCu heat sink with different Cu content,analyzed the influence of Cu content of WCu heat sink on deformation and residual stress distribution of packaging structure theoretically.The results show that with the increase of Cu content,the peak stress of ceramic parts decreases from large to small,and then increases with the increase of Cu content.The location of stress concentration also shifts in the range of 10~20%.The direction of the heat sink deformation is reversed to forward bending gradually,and the law can be verified experimentally.The results have guiding significance to the reliability evaluationand optimization design of the package shell.更多还原