【摘要】 研究了AlN陶瓷间的Ag70Cu28Ti2活性焊膏钎焊封接工艺。封接温度和封接保温时间对Al N接头强度有很大的影响。实验结果表明,在800~950℃下保温5~30 min,钎焊接头的剪切强度达到峰值。通过扫描电子显微镜及X射线能谱仪观察了焊层组织与形貌,获得了元素组成与分布,发现活性元素Ti主要分布在焊层与陶瓷的界面处。更多还原

【Abstract】 Sealing and bonding of AgCuTi active solder paste between AlN ceramics has been studied. The bonding temperature and holding time has a great influence on the strength of Al N/Ag Cu Ti/AlN joints. The results show that the shear strength of the bonding joint reaches the peak value at 800~950 ℃ for 5~30 min. With the aid of scanning electron microscopy and X ray spectrometer, the structure and morphology of the bonding layer was observed, the composition and distribution of elements was obtained. It is found that the active element Ti is mainly distributed at the interface between the bonding layer and the AlN ceramic.更多还原