【摘要】 以蚀刻因子为指标,通过正交试验对电解蚀刻法制备印制电路板（PCB）精细线路的工艺参数进行优化,得到电解蚀刻的最优条件为:2,5-二巯基-1,3,4-噻二唑（DMTD）15 mg/L,CuCl₂ 30 g/L,HCl 0.48 mol/L,阳极电流密度2.4 A/dm²。在最优工艺条件下,蚀刻因子平均达到7.53,所得PCB精细线路平整均匀,无毛边、短路、断路等缺陷,阴极同步回收得到的铜板呈赤红色,回收率为47.67%。更多还原

【Abstract】 The parameters of electrolytic etching process for preparing fine lines of printed circuit board（PCB） were optimized through orthogonal test using etching factor as indicator. The optimal conditions of electrolytic etching are as follows: 2,5-dimercapto-1,3,4-thiadiazole（DMTD） 15 mg/L, CuCl₂ 30 g/L, HCl 0.48 mol/L, and anodic current density 2.4 A/dm². The average etching factor under the optimal conditions reached 7.53, the fine lines obtained on PCB were level and uniform without defects such as rough edge, short circuit, and broken circuit. The copper plate simultaneously reclaimed at the cathode was reddish with a recovery of 47.67%.更多还原