【摘要】 使用光纤布拉格光栅(Fiber Bragg Grating, FBG)传感器实时在线监测电子封装用液态环氧树脂固化过程中的温度和应变,以及在同一模具内相同水平高度、不同位置处(FBG传感器所测)的温度和应变随固化时间的演变,研究了环氧树脂用量对树脂固化过程中温度和应变演变的影响。结果表明:在环氧树脂固化过程中模腔内同一水平高度、不同位置处的应变-时间曲线和温度-时间曲线有很好的一致性,说明在环氧树脂的固化过程中温度和应变响应与水平位置无关;同时,在FBG传感器埋入位置固定的前提下,树脂固化过程中的温度最大值和树脂完全固化后的最终残余应变都随着环氧树脂用量的增加而增大。更多还原

【Abstract】 During curing process, the temperature and strain of liquid epoxy resin, which was used for electronic packaging, were online monitored by fiber Bragg grating(FBG) sensors. The evolution of the temperature and strain with the curing time was measured by FBG sensors in the same mould for various desired spots, where locate at the same height but different positions. Besides, under the same experimental condition, the effect of the epoxy resin dosage on the temperature-and strain-evolution was also examined.The results show that during the curing process, the strain-time and the temperature-time curves for the epoxy resin at the same height but different positions have good consistency, which means that the temperature and strain responses during the curing process of the epoxy resin are independent of the horizontal position. In addition, for fixed embedded positions of FBG sensors, both of the maximum temperature during thecuring process and the final residual strain after curing increase with the increasing dosage of epoxy resin.更多还原