【摘要】 电子产品绿色化的需求促进了电子组装中钎料合金的无铅化发展。目前,Sn-Cu系钎料以优良的综合性能和较低的成本成为最具使用前景的无铅钎料之一。但是Sn-Cu系钎料的熔点较高,在Cu基上的铺展性和钎焊性也较Sn-Pb钎料差,这在很大程度上限制了其应用。通过添加多种合金元素可改善Sn-Cu合金的微观组织和焊接性能。本文首先系统地综述了合金元素对Sn-Cu系无铅钎料微观组织、润湿性、力学性能等的影响,然后指出Sn-Cu系无铅钎料存在的问题。最后,对Sn-Cu系无铅钎料的发展方向和前景进行了展望。更多还原

【Abstract】 The environmental protection need of electronic products has promoted the development of lead-free solder alloys in the field of electronic assembly.At present,Sn-Cu based solder is one of the most promising lead-free solders with excellent performances and lower cost.However,the higher melting point,poorer spreading and soldering properties of Sn-Cu based solder on Cu substrate compared with the Sn-Pb solder limit its extensive application.The microstructure and welding performance of Sn-Cu alloy can be improved by adding various alloying elements.Therefore,in this paper,the effects of micro-alloying on the microstructure,wettability and mechanical properties of Sn-Cu based lead-free solders are systematically reviewed.Then,the problems of the alloying for Sn-Cu based solder are pointed out.The development direction and foreground of Sn-Cu based lead-free solders are also discussed.更多还原