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短切玻纤增强PEKK与BDM/DABPA共混体系固化反应动力学及断裂韧性
Curing Kinetics and Fracture Toughness of BDM/DABPA System Modified by Short Glass Fiber Reinforced Polyether Ketone Ketones(PEKK-GF)
【摘要】 利用二烯丙基双酚A(DABPA)对二苯甲烷型双马来酰亚胺(BDM)树脂进行扩链,采用短切玻纤增强聚醚酮酮(PEKK-GF)对BDM/DABPA树脂进行改性。利用差示扫描量热法(DSC)研究了PEKK-GF改性BDM/DABPA树脂固化动力学,确定了改性树脂的固化工艺,并计算出了改性树脂的部分动力学参数。改性树脂的力学性能通过万能拉力机进行测试,结果表明当BDM/DABPA体系中加入10%(质量分数)的PEKK-GF时,改性树脂固化物的冲击强度比原来体系提高了69%,临界应力强度因子(KIC)和临界应变能释放率(GIC)值分别为1.22 MPa·m0.5和295J/m~2,分别提高了21%和59%;拉伸强度从85.21 MPa增加到96.39 MPa,拉伸模量从4.198GPa增加到4.531GPa;弯曲强度从133.0 MPa增加到140.4 MPa,弯曲模量从4.080GPa增加到4.251GPa。采用动态热机械分析法(DMA)对改性树脂体系耐热性进行研究,结果表明,当BDM/DABPA树脂中加入10%(质量分数)的PEKK-GF时,改性树脂固化物的玻璃化温度提高了16.5℃,达到263.5℃。该改性树脂综合性能优异,在耐高温预浸料基体树脂及胶黏剂等领域具有很好的应用前景。
【Abstract】 Diphenylmethyenebismaleimide(BDM)chain was extended by diallyl bisphenol A(DABPA).Short glass fiber reinforced polyether ketone ketones(PEKK-GF)was used to modify the BDM/DABPA resin.The curing kinetics of the BDM/DABPA resin modified by PEKK-GF was investigated by non-isothermal differential scanning calorimetry(DCS).Curing process of the modified resin was determined and some kinetic parameters were calculated.The mechanical properties of the modified resin were tested by universal tensile machine.The results showed that the impact strength of the cured modified resin was improved by 69%.The plan strain critical stress intensity factor(KIC)and the plan strain critical strain energy release rate(GIC)of the modified resin could reach 1.22 MPa·m0.5 and 295 J/m2,increased by 21% and 59% respectively when 10 wt% PEKK-GF was used.Tensile strength increased from 85.21 MPa to 96.39 MPa and tensile modulus increased from 4.198 GPa to 4.531 GPa.Bending strength increased from 133.0 MPa to 140.4 MPa and bending modulus increased from 4.080 GPa to 4.251 GPa.The thermal stability was characterized by dynamic mechanical analysis(DMA).The results showed that the glass transition temperature(Tg)of cured modified resin reached 263.5℃,which increased by 16.5℃.With these excellent performances,the modified resin may be applied to the fields of high temperature prepreg and adhesive.
【Key words】 polyether ketone ketones; bismaleimide; curing reaction kinetics; fracture toughness;
- 【文献出处】 材料导报 ,Materials Review , 编辑部邮箱 ,2018年06期
- 【分类号】TQ327.1
- 【被引频次】6
- 【下载频次】138