【摘要】 针对设计制作的硅三明治MEMS电容式加速度传感器,利用COMSOL软件建立了封装结构有限元模型,仿真分析了贴片工艺对传感器芯片变形的影响。通过对贴片前后传感器CV特性曲线的测试,发现贴片后传感器在测量CV特性曲线时中间质量块会经历平动和转动的过程,曲线会出现明显拐点,提出了利用CV特性曲线计算贴片后传感器敏感质量块偏移大小和扭转角度的方法,通过该方法计算的结果与有限元仿真结果相符。更多还原

【Abstract】 Based on the sandwich MEMS capacitive accelerometer we designed,the encapsulation structure model is established by using COMSOL software,and the effect of the die bonding process on chip deformation is studied. According to the CV characteristic curves of the accelerometer before and after the die bonding process,it was found that the sensitive mass of the accelerometer experiences the process of translation and rotation while measuring the CV characteristic curves after the die bonding process,the curve appears obvious turning point,this paper puts forward the method to calculate offset value and torsion angle of the sensitive mass. The results calculated by the method are in conformity with the finite element simulation results.更多还原