【摘要】 对聚酰亚胺(PI)+二叠氮萘醌(DNQ)型及聚酰亚胺前驱体(聚酰胺酸,PAA)+DNQ型正性光刻胶材料的研究成果进行了综述。讨论了这两种正性光刻胶材料中成膜剂的设计和制备方法。其中:前者在PAA主链中引入疏水基团,抑制PAA的溶解性;后者在PI主链中引入亲水基团,促进PI的溶解性,从而使其能被用于正性光敏聚酰亚胺。讨论了DNQ光敏剂的结构设计和种类、光刻胶的配比和光刻性能,以及正性光敏聚酰亚胺在航天领域中的应用现状与展望。更多还原

【Abstract】 The latest researches on positive-tone photosensitive polyimides(p-PSPIs)composed of polyimide(PI)/poly(amic acid)(PAA)and a diazonaphthoquinone photoactive compound(DNQ PAC)were summarized in this paper.The design and perparation of these two positive-tone photosensitive polyimides were discussed.In order to prepare suitable resists for the fabrication of p-PSPIs,hydrophobic groups were introduced into PAA polymer chains to depress their solubility,while hydrophilic groups were introduced into PI polymer chains to improve their solubility.The detailed preparation methods of the PI and PAA resists were summarized.The structural design of DNQ PACs,DNQ loading and lithographic performance of each p-PSPI were described.Furthermore,the applications of p-PSPIs to aerospace were also presented.更多还原