【摘要】 以集成电路阻挡层材料钽为对象,研究其表面划痕过程中的声发射特性,初步探索材料去除机制,分析划痕参数对声发射特性的影响,为采用声发射技术监测材料去除过程提供依据。结果显示:在划痕过程中,钽交替经历犁沟和塑性流动,形成深浅起伏的沟槽,并产生连续型声发射信号;随着划痕速度增加,信号强度增高,包络波动更剧烈,冲击性更强,而中位频率先升高、后稳定甚至降低;随着划痕载荷增加,信号增强,冲击性呈正相关变化。钽的表面划痕过程可以用声发射表征。更多还原

【Abstract】 Tantalum,a kind of material used as barrier layer in integrated circuits,was selected to study the acoustic emission characteristics during the scratch process on its surface. The material removal mechanism was preliminarily explored,and the effects of scratch parameters on acoustic emission characteristics were analyzed to provide support for monitoring material removal process based on acoustic emission. The results show that during the scratch process,ploughing alternates with plastic flow,a groove with fluctuating depth is formed,and continuous acoustic emission signal is generated.With the rise of scratch velocity,the signal intensity is increased,the signal envelope fluctuates more drastically,and the signal shows stronger impulsiveness,while the median frequency is increased in the beginning,then stays stable or even drops. With the rise of scratch load,the signal becomes stronger,and the impulsiveness variates with the law of positive correlation. The scratch process on tantalum surface can be characterized by acoustic emission.更多还原