【摘要】 为了降低耐高温低发射率涂层固化温度,分别向涂层中加入固化剂和不同粒径的CeO₂填料来调节涂层固化的化学交联和物理失水过程。研究了氟硅酸钠和CeO₂粒径对涂层低温固化时的交联度及抗热震性能的影响。采用透射电镜对硅酸盐粘合剂三维网络状结构进行表征,用扫描电子显微镜观察涂层表面孔隙分布,并用IR-2型发射率测量仪测量涂层的发射率。研究表明,通过本文方法可实现涂层在35℃低温固化并保持良好的抗热震性能,抗热震可达40次,且仍满足低发射率要求,最低发射率为0.376。更多还原

【Abstract】 To reduce the curing temperature of heat-resistant low-infrared-emissivity coatings,the curing agent and the CeO2 packing with different grain sizes are added into the coatings to adjust the chemical cross-linking and physical water loss of the curing coatings,respectively.The effect of curing agent and CeO2 size on the cross-linking degree and thermal shock performance of coatings is investigated.Threedimensional network structure of the silicate binder is characterized by transmission electron microscopy(TEM).The pore distribution of the coatings is observed by scanning electron microscope(SEM).And then,the infrared emissivity of the coating is measured by IR-2.The results show that,coatings can not only cure at low temperature(35℃)and maintain the good thermal shock performance(40times),but also keep low infrared emissivity with the lowest one of 0.376.更多还原