Polyimide(PI) has been widely used in electronic packaging because of its excellent electrical,mechanical and thermal properties. Due to the low intrinsic thermal conductivity of PI, it is important to enhance the thermal conducting properties of PI to meet the requirement of heat dissipation in modern electrical system. In this paper, the research progress of thermal conductive and insulating composites prepared by BN and PI was summarized, and the effects of fillers size, filler treatment, and composite f...
| 
推荐 
点击下列相关研究机构和相关文献作者，可以直接查到这些机构和作者被《中国知识资源总库》收录的其它文献，使您全面了解该机构和该作者的研究动态和历史。
