【摘要】 以0805封装片式电容器件焊点为研究对象,建立了多周期温度冲击下Sn96.5/Ag3/Cu0.5的焊点有限元分析模型,开展了多周期温度冲击条件下焊点剪切力测试工作,获得了Sn96.5/Ag3/Cu0.5和Sn63/Pb37两种焊点的周期-剪切力测试数据,并利用非线性最小二乘法得到了1 500个周期内的焊点热疲劳状态拟合曲线.结果表明,在规定试验条件下,在有限的1 500个周期内0805封装电容的Sn96.5/Ag3/Cu0.5焊点的热疲劳劣化速率略慢于Sn63/Pb37焊点.更多还原

【Abstract】 With the use of Pb in a variety of occasions prohibited,Lead-free technology becomes one of important research direction.For understanding the fatigue properties of lead-free solder,there is important significance to analyse fanalyse state of lead-free solders and to research on the method of testing.With the 0805 chip capacitor device package solder joints as the research object,Sn96.5/Ag3/Cu0.5 solder joints finite element model is established for multi period under temperature cycles.And shearing test is carried out.The value of Period-shearing stress to Sn96.5/Ag3/Cu0.5 and Sn63/Pb37 solders is obtained.Thermal fatigue fitting curves of solder in 1 500 periods is acquired,by using nonlinear least square method to fit curves.The results indicates that under the stipulated test condition,in limited 1 500 periods,thermal fatigue performance of Sn96.5/Ag3/Cu0.5 solder joints’ rate of thermal fatigue deterioration to 0805 capacitance is slightly slower than that of Sn63/Pb37 solder joints.更多还原