节点文献
低温大功率电阻阵列封装设计与仿真分析
Low Temperature High-Power Resistor Array Detector Packaging Design and Simulation Analysis
【摘要】 电阻阵列探测器规模已经达到256×256,红外景象生成器要求像素规模能够进一步提高,达到512×512及以上。空间低温动态场景模拟用512×512电阻阵探测器的极端功耗高达500 W,并且其工作温度为100K的低温。设计了低温大功率电阻阵列的封装结构,并对该结构进行了热力学仿真分析与实验验证。电阻阵列探测器封装在内部为真空的壳体内,以液氮为循环介质的大冷量换热装置,探测器安装在换热装置的冷端上。仿真分析表明通过液氮可以实现探测器低于100K的制冷;采用试验件对制冷性能进行了验证,验证结果表明设计可行、合理。
【Abstract】 Resistor array detector size of 256×256 has been used,but infrared scene simulation system needs the pixel size reach up to 512×512and above.The extreme power of resistor array detector for space dynamic infrared simulation application will be 500 Wand the working temperature is about 100 K.In this paper,a resistor array assembly structure for low temperature high-power application is designed,and the thermodynamic simulation analysis and experimental verification are carried out.The resistor array detector is packaged inside a vacuum cavity.In order to achieve high power resistor array detector cooling,the detector is installed on the cold end of circulator,which uses liquid nitrogen as a circulation medium.The simulation analysis shows that the detector temperature can be cold to 100 K.A validation test pieces,for cooling performance test,the feasibility and rationality of the design are verified.
【Key words】 resistor array; infrared scene simulation; cryogenic cooling; high-power;
- 【文献出处】 光学与光电技术 ,Optics & Optoelectronic Technology , 编辑部邮箱 ,2017年03期
- 【分类号】TN21
- 【被引频次】2
- 【下载频次】98