【摘要】 随着电子封装技术的发展,传统键合金丝在性能和价格上已经不具备优势。采用复合和改性等方法可以开发出满足要求的键合金丝替代品。总结了金包银复合键合丝、钯包铜复合键合丝、金合金键合丝和银合金键合丝共4种键合金丝替代产品的性能特点、成分配比、生产技术难点和关键点,介绍了部分典型产品,并对替代产品的发展趋势进行了展望。更多还原

【Abstract】 With the development of electronic packaging technology,the traditional bonding gold wire is losing the advantage,due to its low performance and high price.The substitute products have been developed by compounding and modifying the existing bonding gold wire,in order to meet new requirements.The present article summarized the performance feature,composition,key preparative technology of four substitute products.They are Au-coated Ag composite bonding wires,Pd-coated Cu composite bonding wire,Au alloy bonding wire and Ag alloy bonding wire.Some typical products were presented,and the future development was prospected.更多还原