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X7R特性MLCC用低温烧结铜端电极浆料的研究

Research of Low-temperature Sintering Copper Temination Paste for X7R-MLCC

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【作者】 尚小东宋永生罗文忠吴海斌王文姬林立康

【Author】 Shang Xiaodong;Song Yongsheng;Luo Wenzhong;Wu Haibin;Wang Wenji;Lin Likang;State Key Laboratory of Advanced Materials and Electronic Components,Guangdong Fenghua Advanced Technology Holding Co., Ltd.;

【机构】 新型电子元器件关键材料与工艺国家重点实验室广东风华高新科技股份有限公司

【摘要】 针对X7R特性MLCC用端电极浆料领域,结合采用封端烧结制样后电镜分析的表征方法、预分散处理技术,成功研发一种低温铜端电极浆料,用于匹配贱金属X7R特性MLCC产品的生产。实验结果表明:用本低烧铜浆制作的MLCC端电极,具有良好的电性能及可靠性,完全满足MLCC产品的使用要求。

【Abstract】 The copper electrode slurry consists of three parts: copper powder, inorganic glass powder and organic carrier. According to the characteristics of X7R-MLCC, a kind of low temperature sintered copper slurry was prepared, which was successfully developed by the combination of pre dispersion and sem. The experimental results show that the preparation of MLCC products with low temperature copper paste has good performance and reliability, and can meet the requirements of MLCC products.

【关键词】 MLCC铜端电极浆料X7R低温烧结
【Key words】 MLCCcopper temination pasteX7Rlow-temperature sintering
  • 【文献出处】 广东化工 ,Guangdong Chemical Industry , 编辑部邮箱 ,2017年13期
  • 【分类号】TG146.11;TM241
  • 【被引频次】5
  • 【下载频次】380
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