【摘要】 对熔渗法制备的钨铜合金(CuW80)分别进行了3、6、9次烧结。采用金相显微镜、扫描电子显微镜、X射线衍射仪、压汞仪等表征手段,研究了烧结次数对CuW80合金组织和性能的影响。结果表明:随着烧结次数的增加,CuW80合金中钨颗粒直径逐渐增大并连接,铜相分布更加均匀,多次烧结未见新相生成;经过3次烧结后,试样孔隙率由最初的0.5185%变为2.0516%,孔径增加主要集中在0.5~3μm范围内,但9次烧结后试样的孔隙率大大降低;合金硬度由烧结前的HB 204变化至烧结后的HB 188;试样电导率由25.06 mS/m降低至21.92 mS/m;合金密度较烧结前降低了1.2%。更多还原

【Abstract】 Tungsten–copper alloys(CuW80) prepared by infiltration sintering technology were sintered for 3,6,9 times.The microstructure and properties during sintering process were characterized by optical microscopy(OM),scanning electron microscopy(SEM),X-ray diffraction(XRD),and mercury porosimetry.The results show that,with the increase of sintering number,the particle size of tungsten phase increases,the distribution of copper phase is more uniform between W skeleton,and there is no new phase found in the CuW80 alloy after the multiple sintering.The porosity of the Cu W80 alloy increases from 0.5185% to 2.0516% with the pore diameter in 0.5~3 μm after 3 times sintering,however,the porosity of the CuW80 alloy after 9 times sintering greatly reduced.The hardness and conductivity of CuW80 alloy are HB 204 and 25.06 m S/m,respectively,which are reduced to HB 188 and 21.92 m S/m after 9 times sintering.The alloy density decreases by about 1.2% compared with the original alloy.更多还原