【摘要】 以环氧丙烯酸酯作为基体树脂,铜基有机金属络合物为激光活化前驱体,正丁醇和二甲苯为混合溶剂,添加分散剂以及填料,制备一种用于选择性激光诱导金属化图形制备的新型涂料。采用刷涂或喷涂方法将涂料涂覆在铝合金片表面,可形成平均厚度为47?m的膜层。对涂层表面进行选择性激光活化和化学镀铜处理,制备出金属化图形。分别采用光学显微镜、扫描电镜(SEM)和XPS光电子能谱对涂层与镀铜膜的表面形貌以及激光刻蚀区域铜元素的化学价态进行表征,采用十字划痕测试和热震实验测试涂层与镀铜膜的附着力。结果表明:未经激光刻蚀的涂层表面光滑平整,而刻蚀后的区域表面粗糙度增加,但刻蚀边缘光滑无毛刺。刻蚀区域经化学镀形成的金属化图形,由粒径为10μm的铜颗粒紧密排列而成,未刻蚀区域没有泛镀,表现出优异的选择性。涂层和金属化铜镀层与铝金属基体之间具有优良的附着力。更多还原

【Abstract】 A novel solvent-based coating for site-selective electroless metallization was fabricated using epoxy-acrylate as matrix resins, copper-based organometallic compounds as laser-activated precursors, n-butanol and xylene as solvent and addition of dispersing agent and filler. A coating film with a thickness of 47 ?m was deposited onto aluminum alloy plates by spraying. Copper patterning was produced on the coating film surface by site-selective laser irradiation and electroless deposition of copper. Optical microscopy, scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy(XPS) were used to characterize the surface morphologies of coating film and copper layer as well as the valence of copper in laser irradiated area, respectively. Adhesion of coating film and copper layer was measured by cross cut test and thermal shock test. The results show that the coating film surface without laser irradiation appears smooth while the etching area is rough and its edge is smooth and free of burrs. The metallic patterns consist of compact copper particles with the diameter of 10 ?m, while no over-plating is observed on the non-irradiated area, indicating an excellent selectivity. A good adhesion property both for coating film and the copper patterning to the aluminum substrate is confirmed.更多还原