【摘要】 以硫氰酸亚金钾[KAu（SCN）₂]为金源对镀镍印制线路板进行化学镀金。采用单因素试验研究了镀液中Au⁺含量、硫氰酸铵含量、pH和温度对沉金速率、金层外观和结合力的影响,得到最优配方和工艺参数为:Au⁺2.0 g/L,硫氰酸铵15 g/L,添加剂Cy-808 150 mL/L,pH 3.0,温度50℃。在此条件下沉金速率约为6 nm/min,结晶均匀细致,呈光亮的金黄色。更多还原

【Abstract】 Electroless gold plating was conducted on the surface of nickel-plated printed circuit board using potassium gold（Ⅰ） thiocyanate [KAu（SCN）₂] as main salt. The effects of Au⁺ and ammonium thiocyanate contents, as well as pH and temperature of the bath on deposition rate, appearance and adhesion of gold coating were studied by single-factor experiment. The optimal bath composition and process parameters were obtained as follows: Au⁺ 2.0 g/L, ammonium thiocyanate 15 g/L, additive Cy-808 150 m L/L, temperature 50 ℃, and pH 3.0. The gold deposition rate under the given process conditions is ca.6 nm/min. The obtained gold coating is uniform, compact, bright and golden yellow.更多还原