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磁控溅射制备导电织物的工艺优化

Process optimization of conductive fabrics prepared by magnetron sputtering

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【作者】 禚云彬杜文琴

【Author】 Zhou Yunbin;Du Wenqin;School of Clothing and Design,Guangzhou Nanyang Polytechnic;School of Textile and Clothing,Wuyi University;

【机构】 广州南洋理工职业学院服装与设计学院五邑大学纺织服装学院

【摘要】 为制得具有更小电阻即更好导电性能的织物,利用磁控溅射技术,以铜作为靶材,在涤纶纺黏热轧非织造布上沉积铜薄膜制备导电织物,测试其表面电阻值。分别对进气量、溅射功率、工作气压、靶基距、溅射时间进行单因素试验,探究溅射工艺参数对试样导电性能的影响规律;然后在单因素试验基础上对试验进行二次正交旋转组合设计,对显著因素进行参数优化。得出:制备较低表面电阻值的导电织物的最优参数组合为进气量35.00 m L/min、溅射功率83.0 W、工作气压0.400 Pa、靶基距3.900 cm、溅射时间4.10 min,所得导电织物表面电阻值在1.000 0~100.000 0Ω。

【Abstract】 In order to prepare fabrics that possessed better conductivity,with Cu as target materials,the conductive fabrics were obtained through using magnetron sputtering technique to deposited Cu on the polyester spun-bonded hot rolled nonwovens. And their surface resistance was tested. The air input,the sputtering power,the working pressure,the target-substrate distance and the sputtering time were researched respectively by the single factor experiments,in order to explore the relationship between the sputtering process parameters and the conductive performance of the samples. Then,the optimum conditions were obtained by the design of quadratic general rotation combination based on single factor experiment. The optimum combination of preparing conductive fabric with a lower surface resistance was that the air input was 35. 00 m L/min,the sputtering power was 83. 0 W,the working pressure was 0. 400 Pa,the target-substrate distance was 3. 900 cm and the sputtering time was 4. 10 min.And the resistance range of the conductive fabrics was 1. 000 0 ~ 100. 000 0 Ω.

  • 【文献出处】 产业用纺织品 ,Technical Textiles , 编辑部邮箱 ,2017年09期
  • 【分类号】TS176
  • 【被引频次】3
  • 【下载频次】96
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