【摘要】 采用差示扫描量热分析法,研究了印制电路板（PCB）绝缘层树脂——感光改性环氧树脂预固化体系中固化剂2123型酚醛树脂和固化促进剂咪唑的合适配比。利用硅烷偶联剂对纳米SiO₂进行表面处理制得亲油性纳米SiO₂,将其掺入到感光改性树脂固化体系中以提高体系的热稳定性能。采用正交实验和单因素实验方法,研究了亲油性纳米SiO₂用量、固化最高温度、最高温度固化时间3个因素对该树脂体系固化产物在200℃的热降解量的影响。结果表明,感光改性环氧树脂/2123型酚醛树脂/咪唑最佳质量比为100/5/1.5,此时的固化反应最为完全;在掺杂纳米SiO₂的感光改性树脂的最佳固化工艺条件下,即当亲油性纳米SiO₂质量分数为5%,固化最高温度为120℃,最高温度固化时间为2 h时,固化产物的200℃热降解量为0.94%。更多还原

【Abstract】 The optimum proportions of curing agent 2123-type phenolic resin and curing accelerator imidazole in the pre-curing system of the PCB insulation resin——photosensitive epoxy resin were studied by differential scanning calorimetry method. The surface of the nano-silica was treated by silane coupling agent for preparing lipophilicity nano-silica. The lipophilicity nano-silica was incorporated into the photosensitive resin curing system in order to improve the thermal stability of the system. The influences of the lipophilicity nano-silica content,highest curing temperature and curing time at the highest temperature on 200℃ thermal degradation of the photosensitive epoxy resin curing products were investigated and analyzed by orthogonal experiments and single factor experiments. The results show that the optimal mass proportion of the photosensitive epoxy resin/2123-type phenolic resin/imidazole is 100/5/1.5,and the curing reaction is the most complete. It’s also showed under the optimum curing process,which the lipophilicity nano-silica content is 5%,the highest curing temperature is 120℃ and the curing time at the highest temperature is 2 h,the 200℃ thermal degradation of the curing products is only 0.94%.更多还原