A Ni-P coating was deposited on Cu substrate by electroless plating and the Al/Cu bimetal was produced by solid-liquid compound casting technology. The microstructure, mechanical properties and conductivity of Al/Cu joints with different process parameters(bonding temperature and preheating time) were investigated. The results showed that intermetallics formed at the interface and the thickness and variety increased with the increase of bonding temperature and preheating time. The Ni-P interlayer functioned...
【基金】
Project(51571080)supported by the National Natural Science Foundation of China
【更新日期】
2016-07-28
【分类号】
TB331;TG24
【正文快照】
1 Introduction
Bimetal compound materials have been widely studied and used in the last few decades attributing to its combination of the unique and numerous advantages of the bimetals,such as copper and aluminum compound structure[1-3].Copper and its al
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