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固溶处理对SiC_p/Al-Cu-Mg复合材料组织和性能的影响

Microstructure and Properties of SiC_p/Al-Cu-Mg Composites with Solution Treatment

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【作者】 王德升魏少华樊建中马自力聂俊辉

【Author】 Wang Desheng;Wei Shaohua;Fan Jianzhong;Ma Zili;Nie Junhui;National Engineering Technology Center for Nonferrous Metal Composites,General Research Institute for Nonferrous Metal;

【机构】 北京有色金属研究总院国家有色金属复合材料工程技术研究中心

【摘要】 采用粉末冶金方法和等温锻造技术制备了15%Si Cp/Al-Cu-Mg复合材料锻件,通过光学显微镜(OM)、扫描电镜(SEM)、透射电镜(TEM)、能谱仪(EDS)、X射线衍射(XRD)和室温拉伸测试等方法研究了固溶温度与固溶时间对复合材料锻件微观组织和力学性能的影响。结果表明,热处理固溶温度较低、时间较短时,可溶性第二相粒子未充分回溶到铝基体中,铝基体的固溶强化效果不理想,材料强度较低;然而,固溶温度过高易导致材料过烧,从而导致材料的强度和塑性均降低。对复合材料物相分析表明,锻造态复合材料中的第二相主要是Al2Cu,Mg2Si以及少量的含Fe相,经510℃固溶2 h后,Al2Cu相可以充分回溶,而Mg2Si和含Fe相依然残留在基体中。复合材料最佳固溶温度是510℃,最佳固溶时间是2 h。此时获得的力学性能为:抗拉强度(Rm)=579 MPa、屈服强度(Rp0.2)=390 MPa、延伸率(A)=7%。

【Abstract】 15% Si Cp/ Al-Cu-Mg composite fabricated by powder metallurgy was processed by isothermal forging. The effects of solution treatment parameters on microstructure and tensile properties of the composite were studied by optical microscopy( OM),scanning electron microscopy( SEM),transmission electron microscope( TEM),energy dispersive spectrometer( EDS),X-ray diffraction( XRD) and tensile testing. The results showed that the insufficient solution time and lower solution temperature were not beneficial to the re-solution of soluble second phase particles into the matrix and the strength increase of the composite after natural aging. The composite was easily over-burned by high solution temperature,which reduced the strength and the plasticity. The results of XRD and EDS showed that the re-solved particles were Al2 Cu,but Mg2 Si and minor compounds containing Fe were always present during solution treatment. The best solution temperature and time of the composites were 510 ℃ and 2 h,respectively. And the tensile strength( Rm),yield strength( Rp0. 2) and elongation( A) of the composite were 579 MPa,390 MPa and 7%,respectively.

【基金】 国家科技部国家重点基础研究发展计划(973计划)项目(2012CB619606)资助
  • 【文献出处】 稀有金属 ,Chinese Journal of Rare Metals , 编辑部邮箱 ,2016年02期
  • 【分类号】TG156.94;TB33
  • 【被引频次】9
  • 【下载频次】209
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