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利用MIVM模型预测冶金级硅真空精炼过程杂质的挥发特性

Modeling and Calculation of Impurities Volatilization in Vacuum Refining of Metallurgical Grade Silicon

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【作者】 于强伍继君马文会刘凯魏奎先杨斌戴永年

【Author】 Yu Qiang;Wu Jijun;Ma Wenhui;Liu Kai;Wei Kuixian;Yang Bin;Dai Yongnian;Key Laboratory for Nonferrous Vacuum Metallurgy of Yunnan Province,Kunming University of Science and Technology;Engineering Research Center for Silicon Metallurgy and Silicon Materials of Yunnan Provincial Universities,Kunming University of Science and Technology;State Key Laboratory of Complex Nonferrous Metal Resources Cleaning Utilization in Yunnan Province,Kunming University of Science and Technology;

【机构】 昆明理工大学云南省有色金属真空冶金重点实验室昆明理工大学云南省高校硅冶金与硅材料工程研究中心昆明理工大学复杂有色金属资源清洁利用国家重点实验室

【摘要】 运用分子相互作用体积模型预测了二元硅基熔体中Zn、Sb、Mg、Mn、Cu和Sn的活度系数.结合模型所得的对势能相互作用B参数和活度等热力学数据,计算了硅与各杂质元素形成的二元系蒸发系数和挥发速率,绘制出了硅基合金蒸馏过程中的气液相平衡图。研究结果表明,模型所预测的活度值与实验值吻合很好,真空精炼有利于Sb、Zn、Mg从硅熔体中分离,而Mn、Cu、Sn难以分离。硅中的各杂质的蒸发行为受其活度和温度的联合控制。本文通过对冶金硅中杂质挥发性质的研究,为真空提纯冶金级硅提供了可靠的理论依据。

【Abstract】 The volatilization of the impurities( Zn,Sb,Mg,Mn,Cu and Sn),in binary Si-based solutions in vacuum refining of metallurgical grade Si,was mathematically formulated with molecular interaction volume model( MIVM),theoretically analyzed in thermodynamics and experimentally investigated. The separation coefficient,volatilization rate and gas-liquid equilibrium diagram of silicon-based binary alloy in vacuum distillation of Si were derived in terms of the pair interaction potential B and activities calculated with MIVM model. The calculated results show that the evaporation of impurity significantly depends on the distillation temperature and its activity. After most Sb,Zn and Mg impurities were removed from the molten silicon,the contents of Mn,Cu and Sn decreased but slowly because of the low evaporation rates. The measured and predicted results were found to be in good agreement. We suggest that the calculation be of some basic interest in vacuum refining of metallurgical grade silicon.

【基金】 国家自然科学基金项目(21563017,51334002);云南省自然科学基金项目(2016FA022)
  • 【文献出处】 真空科学与技术学报 ,Chinese Journal of Vacuum Science and Technology , 编辑部邮箱 ,2016年10期
  • 【分类号】TN304.12
  • 【被引频次】3
  • 【下载频次】154
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