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Growth condition optimization and mobility enhancement through inserting AlAs monolayer in the InP-based InxGa1-xAs/In0.52Al0.48As HEMT structures

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【作者】 周书星齐鸣艾立鹍徐安怀

【Author】 Shu-Xing Zhou;Ming Qi;Li-Kun Ai;An-Huai Xu;State Key Laboratory of Functional Materials for Informatics,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences;

【机构】 State Key Laboratory of Functional Materials for Informatics,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences

【摘要】 The structure of In P-based InxGa1-x As/In0.52Al0.48 As pseudomorphic high electron mobility transistor(PHEMT)was optimized in detail.Effects of growth temperature,growth interruption time,Si δ-doping condition,channel thickness and In content,and inserted Al As monolayer(ML) on the two-dimensional electron gas(2DEG) performance were investigated carefully.It was found that the use of the inserted Al As monolayer has an enhancement effect on the mobility due to the reduction of interface roughness and the suppression of Si movement.With optimization of the growth parameters,the structures composed of a 10 nm thick In0.75Ga0.25 As channel layer and a 3 nm thick Al As/In0.52Al0.48 As superlattices spacer layer exhibited electron mobilities as high as 12500 cm2·V-1·s-1(300 K) and 53500 cm2·V(-1·s-1(77 K) and the corresponding sheet carrier concentrations(Ns) of 2.8×1012cm-2and 2.9×1012cm-2,respectively.To the best of the authors’ knowledge,this is the highest reported room temperature mobility for In P-based HEMTs with a spacer of 3 nm to date.

【Abstract】 The structure of In P-based InxGa1-x As/In0.52Al0.48 As pseudomorphic high electron mobility transistor(PHEMT)was optimized in detail.Effects of growth temperature,growth interruption time,Si δ-doping condition,channel thickness and In content,and inserted Al As monolayer(ML) on the two-dimensional electron gas(2DEG) performance were investigated carefully.It was found that the use of the inserted Al As monolayer has an enhancement effect on the mobility due to the reduction of interface roughness and the suppression of Si movement.With optimization of the growth parameters,the structures composed of a 10 nm thick In0.75Ga0.25 As channel layer and a 3 nm thick Al As/In0.52Al0.48 As superlattices spacer layer exhibited electron mobilities as high as 12500 cm2·V-1·s-1(300 K) and 53500 cm2·V(-1·s-1(77 K) and the corresponding sheet carrier concentrations(Ns) of 2.8×1012cm-2and 2.9×1012cm-2,respectively.To the best of the authors’ knowledge,this is the highest reported room temperature mobility for In P-based HEMTs with a spacer of 3 nm to date.

【基金】 Project supported by the National Natural Science Foundation of China(Grant No.61434006)
  • 【文献出处】 Chinese Physics B ,中国物理B , 编辑部邮箱 ,2016年09期
  • 【分类号】TN322
  • 【被引频次】2
  • 【下载频次】41
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