【摘要】 对磨削加工后的氮化硅陶瓷球面元件进行亚表面损伤深度研究,分析亚表面损伤产生的原因。采用圆形截面抛光法,获得不同磨削工艺参数组合下的氮化硅陶瓷球面元件磨削亚表面损伤深度值。实验研究砂轮磨粒尺寸、砂轮线速度、砂轮直径、进给速度等对元件亚表面损伤深度的影响。结果表明,在实验条件下,亚表面损伤深度随砂轮直径、砂轮线速度的增大而减小,随砂轮磨粒尺寸和进给速度的增大而增大。基于单颗磨粒法向磨削力和当量磨削厚度结合实验结果采用回归分析方法建立了亚表面损伤深度预测模型,可用于指导磨削工艺参数优化和后续光整加工阶段加工余量分配。更多还原

【Abstract】 The subsurface damage depth of spherical surface of silicon nitride ceramic specimens after grinding was studied to analyze the cause of damage.The surface damage depth values under different grinding process parameters were acquired through circular cross section polishing method.This experiment focused on the effect of grinding wheel grain size,linear velocity of grinding wheel,wheel diameter and feed speed on the depth of the surface damage.The results showed that under this experimental condition,the subsurface damage depth decreased with the increase of grinding wheel diameter and linear velocity,while increased along with the increase of grinding wheel grain size and feed speed.Based on single diamond grits normal grinding force and grinding thickness,combined with the experimental results through using regression analysis method,a prediction model of subsurface damage depth was established,which can be used to guide grinding process parameters optimization and subsequent finishing machining allowance distribution processing stage.更多还原