【摘要】 阵列式探测器是背散射成像设备能够小型化的关键。受限于光电转换器件的灵敏度和转换效率等因素,阵列式探测器设计一直进展缓慢。本文提出使用硅光电倍增管(SiPM)作为核心部件,并从准直器、闪烁晶体和光电转换元件进行阵列背散射探测器设计的新思路。利用X射线特征谱线建立仿真模型,确定闪烁体CSI厚度为1 mm;准直器设计为栅格状,栅格高度4 cm,间隔为6 mm;SiPM尺寸相应为6 mm×6 mm。根据设计结果完成了探测器单个组件的加工,通过实际实验验证设计结果,实验证明合理设计的SiPM可以满足本应用长时、低光照强度以及被探测物体的厚度变化范围较大的要求。更多还原

【Abstract】 Design of the array detector is the key to miniaturize the X-ray backscatter imaging system.The development of the array detector is now slow due to the limitation of photoelectric conversion efficiency and sensitivity.SiPM(Silicon Photomultiplier) is used to design the array detector.After the analysis of three parts-collimators,scintillators and photo-electric elements,the design is complete.The thickness of scintillator is determined to be 1 mm by establishing the simulation model based on the X-ray characteristic spectrum.The collimator is grid shaped with 4 cm height and 6mm width,and the SiPM’s area is 6 mm × 6 mm correspondingly.A single detector element is manufactured,and a set of experiments are carried out.The result shows that SiPM is capable in the low light intensity and long time illumination situation.With SiPM a breakthrough is realized in x-ray backscatter array detector design.更多还原