【摘要】 采用光学显微镜、硬度和电导率测试等方法研究了不同变形量Cu-0.1Ag铜银合金不同温度退火下的组织性能变化规律及再结晶特征。结果表明:随变形量增加,再结晶后晶粒更加细小;硬度在回复阶段几乎不变或略有上升,在再结晶阶段直线下降,再结晶完成后硬度趋于定值。退火温度越高,硬度下降较快,再结晶速率较快。电导率在回复与再结晶过程中显著上升,再结晶完成后电导率趋于定值。室温拉拔变形量26%及50%Cu-0.1Ag合金的再结晶激活能分别为82 k J/mol及69.6 k J/mol,在400~500℃范围内完成再结晶所需时间与温度函数关系分别为lnt=8.2×104/RT-7.56和lnt=6.96×104/RT-6.04。更多还原

【Abstract】 Microstructure evolution,mechanical properties and electrical conductivity of Cu-0.1Ag copper silver alloy under different annealing conditions were investigated by means of optical microscope,hardness and conductivity tests.Discovery and recrystallization processes of the alloy with different deformation annealed at different temperatures were characterized.The results show that the average grain sizes of the alloy after annealing becomes finer with increasing deformation.The hardness remains unchanged or becomes slightly higher during recovery process,while it decreases linearly during recrystallization,and then tends to be a constant.When the annealing temperature increases,the hardness drops significantly and the speed of recrystallization increases.The conductivity increases largely due to recovery and recrystallization and reaches a constant after fully recrystallization.The recrystallization activation energy of the Cu-0.1Ag alloy drawing deformation of 26% and 50% at room temperature is determined to be 82 k J /mol and 69.6 k J /mol respectively.The influence of time and temperature on complete recrystallization can be expressed by equations lnt = 8.2 × 104/RT-7.56 and lnt = 6.96× 104/RT-6.04,respectively.更多还原