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基于ICEPAK的EPS控制器的散热优化研究

Heat dissipation optimization of EPS controller based on ICEPAK

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【作者】 刘振华谢伟东李芳

【Author】 LIU Zhen-hua;XIE Wei-dong;LI Fang;Institute of Vehicle Engineering,Zhejiang University of Technology;

【机构】 浙江工业大学车辆工程研究所

【摘要】 针对EPS控制器中MOSFET管过热而造成控制器失效的问题,对EPS控制器的散热性能进行了分析。基于传热学理论,计算MOSFET的功率损耗并系统分析了控制器的散热路径,初步选择了散热器的参数并利用三维设计软件建立了控制器的仿真模型,运用热分析软件ICEPAK对控制器的仿真模型进行了数值模拟,得到了控制器稳态工作条件下的温度场。同时结合影响散热器散热性能的因素,分别以散热器热阻、质量和MOSFET温度为优化目标对散热器结构参数进行了优化。最后利用高低温交变试验箱和温度传感器,对控制器在高温、负载下的散热器底板温度进行了测量并记录试验数据。实验结果表明,控制器温度场的仿真是准确的,两者最大误差在15%以内,证明优化后的散热器结构是合理的,同时也验证了模拟仿真对控制器散热设计的可行性和有效性。

【Abstract】 Aiming at the problem of controller failure caused by overheat of MOSFET tube in EPS controller,the heat dissipation performance of EPS controller was analyzed. Based on heat transfer theory,the power loss of the MOSFET was calculated and the thermal dissipation path of the controller was analyzed,the initial parameters of the radiator was choiced and the simulation model of the controller was established with the 3D design software. Then the thermal analysis software ICEPAK was used to numerical simulate the temperature field of the controller under steady state operate. Combining with the factors that affect the radiation performance of the radiator,the quality and the thermal resistance and the temperature of the MOSFET was choiced as the optimization object to optimize the radiator structure parameters of the EPS controller. At last,the high and low temperature alternating test box and the temperature sensor was used to test the bottom board temperature of the radiator as the controller operate in high temperature and load,the test data was recorded and compared with the simulation results.This results indicate that the simulation is right,the maximum error is within 15%,the optimized structure of the radiator is reasonable and verify the feasibility and the effective of the simulation to the thermal design.

【关键词】 EPS控制器MOSFET散热器ICEPAK
【Key words】 EPS controllerMOSFETheat dissipationICEPAK
【基金】 浙江省科技计划资助项目(2014C31101);浙江省重点实验室计划资助项目(2013E10031)
  • 【文献出处】 机电工程 ,Journal of Mechanical & Electrical Engineering , 编辑部邮箱 ,2016年08期
  • 【分类号】U464.138+.2;TH122;TK124
  • 【被引频次】9
  • 【下载频次】158
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