【摘要】 通过对反应界面微观组织形貌的表征分析,系统研究了热老化条件下微量Ni元素对Snx Ni/Cu（x的质量分数为0,0.05%,0.10%）的界面组织形貌演变及柯肯达尔孔洞形成的影响。结果表明,相对于Sn/Cu界面,添加的Ni元素大幅加速了Snx Ni/Cu界面（Cu,Ni）₆Sn₅层的生长,但显著阻缓了（Cu,Ni）₃Sn层的形成,有效抑制了柯肯达尔孔洞的形成。（Cu,Ni）₆Sn₅层由多层细小晶粒组成,这种多晶界结构有利于界面组分元素的互扩散,可缓解Cu和Sn的不平衡扩散;薄的（Cu,Ni）₃Sn层限制了孔洞的形成空间,从而进一步抑制孔洞的形成。更多还原

【Abstract】 The effects of minor Ni addition on the evolution of microstructure and formation of Kirkendall voids at Snx Ni / Cu interface（ x = 0,0. 05,0. 1 wt. %） under thermal aging were systemically studied through the characterization analysis of interfacial microstructure. The results indicated that comparing with the morphology at Sn/Cu interface,the addition of minor Ni dramatically accelerated the growth of（ Cu,Ni）₆Sn₅ layer at Snx Ni / Cu interface,while inhibited the formation of（Cu,Ni）₃Sn layer and Kirkendall voids effectively.（ Cu,Ni）₆Sn₅ layer consisted of multi-layer small-sized grains. This kind of structure had plenty of grain boundaries,which was helpful for the interdiffusion of interfacial component elements,and could relieve the unbalanced diffusion. The thin（ Cu,Ni）₃Sn layer restricted the formation space of voids,and inhibited the formation of voids furtherly.更多还原