节点文献
软性粒子抛光石英玻璃的材料去除机理
Material removal mechanism for fused glass by using soft particles
【摘要】 基于阿伦尼乌斯原理和分子振动理论,分析了软性抛光粒子、石英玻璃和抛光垫之间的弹性与超弹性接触,研究了用软性粒子抛光石英玻璃的材料去除机理。基于理论研究进行了大量的抛光试验,建立了软性粒子抛光石英玻璃的材料去除率模型。理论计算与试验结果表明:在石英玻璃化学机械抛光中,材料的去除主要由抛光粒子与石英玻璃的界面摩擦化学腐蚀作用来实现;单个抛光粒子压入石英玻璃的深度约为0.05nm,且材料去除为分子量级;石英玻璃表层的分子更易获得足够振动能量而发生化学反应实现材料的去除;抛光压力、抛光液中化学试剂种类和浓度以及石英玻璃试件与抛光盘的相对运动速度决定了软性粒子抛光石英玻璃的材料去除率大小。
【Abstract】 On the basis of Arrhenius theory and molecular vibration theory,the elastic and hyper elastic contact among the soft polishing particles,fused glass and the polishing pad was analyzed,then the material removal mechanism of fused glass using soft particles in polishing process was explored.According to the theoretical research mentioned above,a lots of polishing experiments were carried out and a material removal rate model was established.Theoretical calculation and experimental results show that the material is mainly removed by the interfacial tribo-chemical effect between polishing particles and fused glass in chemical mechanical polishing.The depth of a single particle embedding into the fused glass is 0.05 nm and the material removed by a single particle is a molecular scale.The superficial molecules of fused glass are easier to gain enough energy to implement chemical reactions,so that the materials could be removed easily.Moreover,the polishing pressure,the chemical reagents in polishing liquid,and the relative movement speed between the fused glass and the pad determine the material removal rate of fused glass.
【Key words】 fused glass; chemico-mechanical polishing; soft polishing particle; material removal mechanism; model of material removal rate;
- 【文献出处】 光学精密工程 ,Optics and Precision Engineering , 编辑部邮箱 ,2016年07期
- 【分类号】TQ171.731
- 【被引频次】18
- 【下载频次】465