【摘要】 利用粉末覆盖烧结法成功在金刚石表面镀覆W,并采用气体压力熔渗法制备Cu/diamond(W)复合材料。研究了不同镀覆温度对镀层微观结构以及复合材料热导率的影响。结果表明,金刚石表面镀钨有效的改善了界面结合,提高了复合材料热导率。镀层厚度随镀覆温度的提高而明显增加,复合材料热导率先增高再降低。当镀覆工艺为1 050℃保温15 min时,镀层厚度为2 000nm,复合材料热导率最高可达到670 W/mK。更多还原

【Abstract】 Powder sintering method is applied for W coating.And the Cu/diamond(W)composites were fabricated by gas pressure infiltration.Study the effects of different plating temperature on the coating microstructure and thermal conductivity of the composites.The results showed that the diamond with tungsten coating improve the interface bonding and the thermal conductivity of the composites effectively.The thickness of coating increase significantly with the increase of plating temperature.The thermal conductivity of composite increase firstly and decrease subsequently.When the plating parameters are 1 050 ℃ and 15 min,the thickness of coating is about 2 000 nm,and the thermal conductivity of the composite material can reach 670 W/mK.更多还原