节点文献
LED封装用导电银胶的制备及性能研究
Study on the Preparation and Properties of Conductive Adhesive for LED Packaging
【摘要】 通过研究树脂体系、固化剂及片状银粉对导电银胶体系力学性能、导电性能及耐候性能的影响,制备出可常温储存的导电银胶。结果表明,银粉质量含量75%,环氧树脂(EP)与聚酰胺酰亚胺树脂(PAI)质量比为80/20,二氨基二苯甲烷/二氨基二苯醚质量比为60/40,所配制的导电银胶的性能能够达到技术指标。样品经封装企业进行上线测试,能够满足应用要求。
【Abstract】 By the studing of the influential factors of the resin system, curing agent and flake silver powder on the mechanical properties, conductivity and weather resistance properties, a conductive adhesive which could be stored at room temperature was prepared finally. The results showed that the conductive adhesive with 75% silver powder, the quality ratio of EP resin to PAI resin being 80/20, the quality ratio of 4, 4-diaminodiphenyl methane to 4,4-oxydianiline being 60/40, could meet the technical indicators. After being tested in a LED packaging factory, the bulk production could meet the application requirements of the enterprise.
【Key words】 metal materials; LED; conductive adhesive; flake silver powder; volume resistivity; shear strength;
- 【文献出处】 贵金属 ,Precious Metals , 编辑部邮箱 ,2016年03期
- 【分类号】TQ430.7
- 【被引频次】6
- 【下载频次】404