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LED封装用导电银胶的制备及性能研究

Study on the Preparation and Properties of Conductive Adhesive for LED Packaging

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【作者】 琚伟伊希斌张晶王启春陈义祥范会利牟秋红

【Author】 JU Wei;YI Xibin;ZHANG Jing;WANG Qichun;CHEN Yixiang;FAN Huili;MU Qiuhong;New Material Institute, Shandong Academy of Sciences,Key Lab for Adhesion & Sealing Materials of Shandong Province;Technical Institute of Physics and Chemistry, Chinese Academy of Science;

【机构】 山东省科学院新材料研究所山东省粘结材料重点实验室中国科学院理化技术研究所

【摘要】 通过研究树脂体系、固化剂及片状银粉对导电银胶体系力学性能、导电性能及耐候性能的影响,制备出可常温储存的导电银胶。结果表明,银粉质量含量75%,环氧树脂(EP)与聚酰胺酰亚胺树脂(PAI)质量比为80/20,二氨基二苯甲烷/二氨基二苯醚质量比为60/40,所配制的导电银胶的性能能够达到技术指标。样品经封装企业进行上线测试,能够满足应用要求。

【Abstract】 By the studing of the influential factors of the resin system, curing agent and flake silver powder on the mechanical properties, conductivity and weather resistance properties, a conductive adhesive which could be stored at room temperature was prepared finally. The results showed that the conductive adhesive with 75% silver powder, the quality ratio of EP resin to PAI resin being 80/20, the quality ratio of 4, 4-diaminodiphenyl methane to 4,4-oxydianiline being 60/40, could meet the technical indicators. After being tested in a LED packaging factory, the bulk production could meet the application requirements of the enterprise.

【基金】 山东省中青年科学家科研奖励基金(BS2011CL036);山东省自然科学基金(ZR2015YL002);中国科学院院地合作项目
  • 【分类号】TQ430.7
  • 【被引频次】6
  • 【下载频次】404
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