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RTM工艺用乙烯基酯树脂体系固化动力学

Application in RTM of the vinyl ester resin curing kinetics

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【作者】 赵晓琳杜建华高恒范涛李辉王大峰吕莹莹贾成厂

【Author】 Zhao Xiaolin;Du Jianhua;Gao Heng;Fan Tao;Li Hui;Wang Dafeng;Lv Yingying;Jia chengchang;School of Materials Science and Engineering,University of Science and Technology Beijing;Department of Science Research,Academy of Armored Force Engineering;Department of Self-propelled Gun,Nanjing Artillery Academy;

【机构】 北京科技大学材料科学与工程学院装甲兵工程学院科研部南京炮兵学院自行火炮系自行火炮教研室

【摘要】 采用差示扫描量热法(DSC)对树脂传递模塑(Resin Transfer Molding,简称RTM)工艺应用双酚A型乙烯基酯树脂体系的固化工艺进行研究,分析不同升温速率对固化体系的DSC曲线的影响,并利用Kissinger方程、Crane经验方程等固化动力学方程,确定该固化体系的反应动力学方程t=1-[1-5 584.65exp(-4 352.90/T)t]6.67,采用温度-升温速率(T-β)外推法从理论上得到体系的凝胶温度、固化温度和后固化温度等固化工艺参数为61.66,74.55,95.49℃。在实际应用中,由于内部反应热存在,适当降低使用温度。固化动力学方程及固化工艺参数对树脂传递模塑(RTM)工艺有重要意义。

【Abstract】 The cure technology of bisphenol A type vinyl ester resin system applying to RTM was studied by differential scanning calorimetry( DSC). The curing reaction equation of the resin system was ascertained by Kissinger and Crane equations. The equation was t = 1- [1- 5 584. 65exp(- 4 352. 90 / T) t]6. 67. Gelling temperature,curing temperature and post-treating temperature were calculated by extrapolating Ttemperature-Heating rate( T-β) curves and were 61. 66 ℃,74. 55 ℃,95. 49 ℃,respectively. In practice,due to internal heat of reaction,applicable temperature need to reduce. The curing reaction equation and cure parameters have great significance for Resin Transfer Molding( RTM) process.

【关键词】 乙烯基酯树脂DSC固化动力学
【Key words】 Vinyl ester resinDSCCure kinetics
【基金】 国家自然科学基金(51001117)
  • 【文献出处】 粉末冶金技术 ,Powder Metallurgy Technology , 编辑部邮箱 ,2016年05期
  • 【分类号】TQ323.4
  • 【被引频次】1
  • 【下载频次】162
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