【摘要】 针对MEMS器件用叠层镍间结合强度差这一难题,开展了基于盐酸化学刻蚀提高叠层镍间结合强度的工艺研究.主要考查了不同盐酸浓度、处理温度等对镍层层间结合强度的影响规律.借助SEM、Veeco轮廓分析仪等观察断面,分析结合强度改善的原因.结果表明:在45℃的温度下,经过50%HCl、10 min的化学刻蚀,叠层镍间结合强度达到567.7 MPa,比未经化学刻蚀处理的叠层镍间结合强度提高了6倍.通过SEM、Veeco等分析手段,初步解释了结合强度提高的原因.更多还原

【Abstract】 In order to enhance the adhesion strength between the stacked nickel layers,nickel films were etched by HCl solution. The effects of HCl concentration and temperature on the adhesion strength were investigated. The fracture surface was examined by SEM and Veeco profiler. The results show that the adhesion strength was greatly increased to567 MPa when the nickel layer was etched in 50% HCl for 10 min at 45 ℃,which was 6 times more than that not etched in HCl.更多还原