【摘要】 分析了3D-Plus存储器印制板组件在随机振动和温度循环作用下的等效应力和等效塑性应变。分析结果表明:3D-Plus存储器印制板级组装可靠性的关键在于印制板螺钉固定点的设计,用环氧胶加固可使器件组装的可靠性进一步得到提高。高膨胀系数的3M-2166Gray环氧胶对焊点热疲劳寿命会产生不利影响,但只要将器件引脚和印制板的间隙控制在0.1~0.2 mm之内,并在焊接过程中使引脚根部有焊锡充分爬升,可以获得高可靠焊点。更多还原

【Abstract】 The equivalent stress and equivalent plastic strain of 3D-plus memory stacks PCB assemble under random vibration and thermal cycle has been analyzed. The result indicate that the key reliability of 3D-plus memory stacks PCB assemble is fi x nod of PCB design, the epoxy stacking adhesive can improve the reliability of device assemble more. High coeffi cient of thermal expansion 3M-2216 Gray epoxy stacking adhesive will reduce the solder joint thermal fatigue life, but the high reliability solder joint still be obtained while the distance between lead and PCB be controlled in 0.1~0.2 mm and the soldering tin climb suffi cient on lead root.更多还原