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工艺条件对铝栅化学机械平坦化效果的影响
Effects of process parameters on chemical mechanical planarization of aluminum grid
【摘要】 采用由2.5%(体积分数,下同)硅溶胶磨料、1.5%H2O2、0.5%FA/O型螯合剂和1.0%表面活性剂组成的抛光液对铝栅表面进行化学机械平坦化处理。研究了抛光垫、抛光压力、流量、抛光头转速、抛光垫转速以及抛光后清洗对铝栅表面粗糙度的影响。采用POLITEXTM REG抛光垫,在抛光压力1.5 psi,抛头转速60 r/min,抛光盘转速65 r/min,抛光液流量150 mL/min的条件下,对铝栅抛光后用自主研发的清洗剂清洗,铝栅表面粗糙度最低(2.8 nm),并且无划痕、腐蚀、颗粒残留等表面缺陷。
【Abstract】 The surface of aluminum grid was chemical mechanically polished using polishing bath composed of 2.5vol% silica sol, 1.5vol% H2O2, 0.5vol% FA/O chelant and 1.0vol% surfactant. The effects of polishing pad, polishing pressure, flowing rate of polishing bath, rotating speed of polishing head, rotating speed of polishing pad and post-polishing washing on the surface roughness of aluminum grid were studied. After polishing using POLITEXTM REG polishing pad under the conditions: polishing pressure 1.5 psi, rotating speed of polishing head 60 r/min, rotating speed of polishing pad 65 r/min and flowing rate of polishing bath 150 mL/min, followed by washing with home-made cleaner, the aluminum grid has the lowest surface roughness(2.8 nm) and no surface defects such as scratch, corrosion, residual particles and so on.
【Key words】 aluminum grid; chemical mechanical planarization; defect; surface roughness;
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2016年20期
- 【分类号】TG175.3;TN305.2
- 【被引频次】2
- 【下载频次】38