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工艺条件对铝栅化学机械平坦化效果的影响

Effects of process parameters on chemical mechanical planarization of aluminum grid

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【作者】 张金刘玉岭闫辰奇张文霞牛新环孙鸣

【Author】 ZHANG Jin;LIU Yu-ling;YAN Chen-qi;ZHANG Wen-xia;NIU Xin-huan;SUN Ming;Tianjin Key Laboratory of Electronic Materials and Devices,School of Electronic and Information Engineering,Hebei University of Technology;

【机构】 河北工业大学电子信息工程学院天津市电子材料与器件重点实验室华北理工大学

【摘要】 采用由2.5%(体积分数,下同)硅溶胶磨料、1.5%H2O2、0.5%FA/O型螯合剂和1.0%表面活性剂组成的抛光液对铝栅表面进行化学机械平坦化处理。研究了抛光垫、抛光压力、流量、抛光头转速、抛光垫转速以及抛光后清洗对铝栅表面粗糙度的影响。采用POLITEXTM REG抛光垫,在抛光压力1.5 psi,抛头转速60 r/min,抛光盘转速65 r/min,抛光液流量150 mL/min的条件下,对铝栅抛光后用自主研发的清洗剂清洗,铝栅表面粗糙度最低(2.8 nm),并且无划痕、腐蚀、颗粒残留等表面缺陷。

【Abstract】 The surface of aluminum grid was chemical mechanically polished using polishing bath composed of 2.5vol% silica sol, 1.5vol% H2O2, 0.5vol% FA/O chelant and 1.0vol% surfactant. The effects of polishing pad, polishing pressure, flowing rate of polishing bath, rotating speed of polishing head, rotating speed of polishing pad and post-polishing washing on the surface roughness of aluminum grid were studied. After polishing using POLITEXTM REG polishing pad under the conditions: polishing pressure 1.5 psi, rotating speed of polishing head 60 r/min, rotating speed of polishing pad 65 r/min and flowing rate of polishing bath 150 mL/min, followed by washing with home-made cleaner, the aluminum grid has the lowest surface roughness(2.8 nm) and no surface defects such as scratch, corrosion, residual particles and so on.

【基金】 国家中长期科技发展规划02科技重大专项资助项目(2009ZX02308);天津市自然科学基金(16JCYBJC16100)
  • 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2016年20期
  • 【分类号】TG175.3;TN305.2
  • 【被引频次】2
  • 【下载频次】38
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