【摘要】 综述了国内外化学镀金的研究现状,并从基材、镀金层厚度、镀覆工艺、镀液配方、焊接等方面对印制线路板(PCB)化学镀金的可靠性影响因素进行了分析对比,结合PCB高可靠性的要求,对未来化学镀金的发展进行了展望。更多还原

【Abstract】 The development status of electroless gold plating both at home and abroad was reviewed. The factors influencing reliability of electroless gold plating for printed circuit board(PCB) were comparatively analyzed in respects of substrate, thickness of gold coating, plating process, plating bath composition and welding. The development of electroless gold plating in future was previewed according to the high reliability requirement of PCB.更多还原