The effect of different dilution ratios of the FA/O fast polishing slurry on the removal rate for the fast polishing of 300 mm silicon wafers was studied.It is found that the removal rate of the Si backside is on the low side at the dilution volume ratio of 1∶30.After in-depth analysis of the relationship between the removal rate and temperature for the dilution volume ratio of 1∶30,the removal rate of the Si was improved by adjusting and optimizing the slurry and process.The results show that the start and...